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[ PCIE 4.0 NVME // IDENTIFIED PRODUCT ]

Lexar NM790 2 TB (LNM790X002T-RNNNG)

Product-specific catalog record for the manufacturer code below. Performance figures are manufacturer-rated values, not independent test results.

Original local schematic of Lexar NM790 2 TB (LNM790X002T-RNNNG); not a photograph or dimensional drawing
LOCAL SCHEMATIC // NOT TO SCALE

IDENTIFY THE EXACT SKU: Compare the full MPN, label suffix, form factor, firmware and any OEM/security code before applying these notes. Family variations, capacity changes and factory thermal assemblies can materially change ratings and compatibility.

Manufacturer-identified specifications

Product / MPNLexar NM790 2 TB (LNM790X002T-RNNNG) — LNM790X002T-RNNNG (bare-module SKU; check label suffix)
Capacity / form factor2 TB; M.2 2280, bare module.
Interface / lane widthPCIe 4.0 x4.
ProtocolNVMe 1.4.
Rated performance / enduranceUp to 7,400 MB/s sequential read and 6,500 MB/s sequential write; 1,500 TBW for 2 TB SKU.
Heatsink / revision caveatThis record is for the bare-drive suffix. Lexar also sells a heatsink edition with a different suffix; identify it before planning clearance. NM790 is DRAM-less and uses host memory buffering; this differs from DRAM-equipped Gen4 drives. The heatsink edition is a separate physical variant. Verify the full MPN to avoid applying the bare drive fit notes to the heatsink SKU.

Compatibility, installation & service

  • Verify the motherboard supports M.2 2280 PCIe/NVMe Gen4 and UEFI boot; confirm lane allocation and any M.2 cover arrangement. Do not fit both a factory heatsink and board shield. For the bare model, use board thermal pad only if designed for that socket; keep airflow and monitor temperatures. Back up before firmware, migration or removal.
  • NM790 is DRAM-less and uses host memory buffering; this differs from DRAM-equipped Gen4 drives. The heatsink edition is a separate physical variant. Verify the full MPN to avoid applying the bare drive fit notes to the heatsink SKU.
  • Confirm host boot mode, OS NVMe support, CPU lane generation, socket length/keying, power and controller/backplane qualification from the system manual; physical fit alone does not establish compatibility.
  • Before drive replacement, check backup integrity, encryption keys, firmware settings, recovery media and array rebuild plans. Use electrostatic-discharge precautions and never hot-remove unless the host documentation explicitly supports it.

Manufacturer references

  1. Lexar NM790 with heatsink — manufacturer product specification family page; match suffix to bare/heatsink SKUManufacturer specification/product reference. Verify the precise SKU and its capacity-specific table, manual or linked downloads against the installed drive label.
  2. NVM Express — specificationsProtocol standards reference; it does not establish product-specific features or host boot support.
  3. PCI-SIG — PCI Express specificationsInterface generation/lanes standards reference, not a substitute for the host motherboard/server manual.

Manufacturer peak ratings reflect stated test conditions and may not represent sustained writes in a thermally constrained or cache-exhausted host. Confirm current regional support, service status and warranty terms before use.