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Samsung M378A2K43CB1-CTD

A model-specific DDR4-2666 memory module identified by manufacturer part number M378A2K43CB1-CTD. This record distinguishes the exact product from generation-wide module standards; subrevision, SPD, and platform qualification remain specimen-specific.

Locally stored, labeled schematic for Samsung M378A2K43CB1-CTD; not to scale or a product photograph
UNIQUE LOCAL SVG // REFERENCE SCHEMATIC, NOT TO SCALE

EXACT ID: Samsung M378A2K43CB1-CTD. Do not infer undocumented traits from the SKU alone; verify the label, full suffix, SPD and revision before service or compatibility decisions.

Model specifications

Manufacturer / part IDSamsung M378A2K43CB1-CTD
Module classUnbuffered, non-ECC desktop module; 288-pin desktop UDIMM
Capacity / data rate16 GB; 2666 MT/s (PC4-21300)
Timing / voltageCL19, JEDEC; nominal module voltage 1.2 V. Profile-dependent rates are identified where applicable; JEDEC fallback behavior may be slower.
Interface / organizationDDR4-2666, 288 contacts; 2Rx8. Pin count does not determine electrical compatibility: generation keying and module buffering/ECC class must match.
Platform and bus compatibilityDDR4 UDIMM platforms supporting a 16 GB dual-rank DIMM; confirm board maximum capacity and population rules.
Variant boundarySpecifications describe this full SKU as listed by its maker; manufacturers may change chips, ranks, SPD tables, or component revisions without changing the retail family. Preserve evidence for the actual specimen.

Compatibility, service & archive notes

  • DDR4 UDIMM platforms supporting a 16 GB dual-rank DIMM; confirm board maximum capacity and population rules.
  • Before installation, compare motherboard/server service manual, CPU memory-controller support, BIOS/BMC version, supported capacity per slot, rank/density, channel population and the required ECC/buffering class. Similar pin count or physical fit is not proof of compatibility.
  • Shut the host down and disconnect standby power as the service manual directs. Use ESD controls, handle the module by its edges, keep contacts clean, and never force a notched module. Observe platform-specific discharge and battery procedures.
  • Do not mix UDIMM, RDIMM and LRDIMM in a memory channel unless the platform explicitly documents such a combination. ECC support depends on the CPU, board wiring, firmware and module type. DDR5 on-die ECC is not system-level ECC.

Preservation record

Photograph the label and notch, transcribe the full part number and date/revision code, save a read-only SPD dump, note channel/slot and host configuration, and record BIOS/BMC, operating rate, voltage/profile, memory test method and any ECC/error-counter results. Store removed modules in ESD-safe packaging.

Manufacturer & standards references

  1. Samsung Semiconductor DDR4 product guidePrimary manufacturer reference for the module family or SKU lookup; search/compare the exact part number and revision.
  2. JEDEC JESD79-4 — DDR4 SDRAMGeneration-level interface and electrical context. A standard does not establish a host's support for this capacity, rank, ECC, buffering, or profile.

Check the platform manufacturer’s service manual and qualified-memory list for final validation; saved module SPD and a physical label are the best archival evidence for an individual specimen.