[ INDIVIDUAL COMPONENT // COOLING ]

Noctua NT-H1 3.5 g

3.5 g package of NT-H1 thermal compound; Noctua identifies it as non-electrically-conductive and non-corrosive.

Original local schematic of a Noctua NT-H1 compound application between processor and cooler — ORIGINAL LOCAL VECTOR // NOT TO SCALE OR A PRODUCT PHOTOGRAPH

IDENTIFICATION: NT-H1 package variants include other weights and bundled editions. This record describes the 3.5 g compound package only, not an installation accessory bundle.

Manufacturer specifications

Catalog subcategory	Thermal Accessories
Exact model	Noctua NT-H1, 3.5 g
Material	Thermal compound; Noctua does not disclose a complete formulation in the referenced product documentation.
Package / dimensions	3.5 g net content; product dimensions are not specified by the manufacturer.
Thermal conductivity	Not specified by Noctua; third-party test figures are intentionally not substituted.
Electrical properties	Not electrically conductive; non-corrosive, according to Noctua.
Maker-stated operating range	−50 °C to +110 °C.

Application & compatibility cautions

Use as the thin interface layer between a compatible processor and heatsink/cold plate; follow Noctua and host installation instructions for the correct amount.
Not a gap-filling pad or a substitute for thermal interface material with a specified thickness. Clean and renew after detaching the cooler.
Non-conductivity does not remove the need to avoid sockets, connectors, and unrelated circuitry; confirm direct-die guidance with the component/cooler maker.

Manufacturer sources

Noctua — NT-H1 3.5 g specificationsManufacturer specifications, package amount, and electrical properties.
Noctua — NT-H1 safety data sheetManufacturer safety information for NT-H1 compound.

This static catalog entry is an identification aid, not a compatibility guarantee; check the host and current package documentation.